| The states and processes in grain boundaries of Cu, subjected to severe plastic deformation have been analyzed here. It has been shown that microstructure refinement in the process of severe plastic deformation leads to a hyper sensitivity of the processes occurring in the grain boundaries towards the applied hydrostatic pressure. The temperature alterations of the plastic deformation are also followed by activation or suppression of some or other deformation processes in the grain boundaries of Cu in different structure states. These processes are much more intensive in ultra-fine grain states. It has been demonstrated that the temperature decrease, as well as the hydrostatic pressure increase, brings to the growth of stress in the samples. In connection with this, the tendency is more evident in the samples with an ultra-fine grain structure. |
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