| Bimodal microstructure consisting of ultrafine-grained (UFG) matrix with the embedded micro-size recrystallized grains has been developed in Cu due to equal channel angular pressing (ECAP) and subsequent high strain rate deformation (HSRD). Both high strength and high ductility are characteristic for this microstructure. High strength is achieved by grain refining with high density of high-angle grain boundaries, developed during the ECAP. High ductility is the result of the appearance of dynamically recrystallized grains generated during the HSRD. |
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