| Carries on the investigation to the titanium alloy/Cu/stainless steel intermetallic compound of bonding interface in the meantime, to make a thermodynamic model of the interface element diffusion to have a numerical simulation of the diffusion distance and diffusion temperature, time. Using analysis methods of stretching test, microhardness test, SEM and EDS, to investigate and research the mechanical properties, the interface structure characteristic, the principal element atomic diffusion mechanism of joints thermal simulation and the vacuum diffusion bonding of Ti-6Al-4V/Cu/304, the reacting phases are produced and the distribution range. The results show that when bonding pressure is 5.0 Mpa, the joint's tensile strength first increase and then decreases, with bonding temperature and time rising, When bonding temperature is 1223K, bonding time is 3.6 ks, there is a maximum tensile strength that is 162.73 MPa. However, it will is disadvantageous to performance of the joints, when bonding temperature and time extended overly. It formed multi-phase transition organizations by solid solution, intermetallic compounds in the bonding interface, such as Ti2Cu, TixCuy tie, Ti2Fe, TiFe2 and TiFe. Effect of TixFey on strength of the joints is slightly inferior the TixCuy compound. The fracture is mainly by the titanium alloy side region III for the source dehiscence, developping in the weak diffusion layer. |
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