Crack-free interface in wafer-bonded Ge/Si by patterned grooves
Year(s):
2010
Autors:
Argunova T.S. , d.o.p.a.m.s. Gutkin M.Yu. , Kostina L.S. , Grekhov I.V. , Belyakova E.I. , Je J.H. ,
Name Publication:
Scripta Materialia
Volume Publication:
62
Issue Publication:
6
Pages:
407 - 410