Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple
Year(s):
2021
Autors:
Vladislav Shtegman , Morozov A. , d.o.p.a.m.s. A.B. Freidin , Müller W.H. ,
Name Publication:
AIP Conference Proceedings
Volume Publication:
2371
Issue Publication:
/ 030007