Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Sto
Year(s):
2020
Autors:
Morozov A. , d.o.p.a.m.s. A.B. Freidin , Klinkov V.A. , Semencha A.V. , Müller W.H. , Hauck T. ,
Name Publication:
Journal of Electronic Materials
Volume Publication:
49
Issue Publication:
12
Pages:
7194 - 7210